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specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer ' s products or equipment. to verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. any and all sanyo semiconductor co.,ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. the products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. if you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage conditi on (temperature, operation time etc.) prior to the intended use. if there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. 40412 sy 20120328-s00001 no.a2047-1/12 LV47022P overview the LV47022P is the ic for 4-channel btl power amplifier that is developed for car audio system. pch dmos in the upper side of the output stage and nch dmos in the lower side of the output stage are complimentary. high power and high quality sound are realized by that. this ic incorporate various functions (standby switch, muting function, and various protection circuit) necessary for car audio system. also, it has a self-diagnosis function. functions ? high output : p o max = 48w (typical) (v cc = 15.2v, f = 1khz, r l = 4 , max power) : p o max = 28w (typical) (v cc = 14.4v, f = 1khz, thd = 10%, r l = 4 ) : p o max = 21w (typical) (v cc = 14.4v, f = 1khz, thd = 1%, r l = 4 ) ? built-in muting function (pin 22) ? built-in standby switch (pin 4) ? built-in self-diagnosis function (pin 25) : signal output in case of output offset detection, shorting to v cc , shorting to ground, load shorting and over voltage. ? circuit that decrease of elect ric mirror noise and gsm noise. ? built-in various protection circuit (shorting to ground, shorting to v cc , load shorting, over voltage and thermal shut down) note 1 : please do not mistake connection. a wrong connection may produce destruction, deterioration and damage for the ic or equipment. note 2 : the protective circuit function is provided to temporarily avoid abnormal state such as incorrect output connection. but, there is no guarant ee that the ic is not destroyed by the accident. the protective function do not operate of the operation guar antee range. if the outputs ar e connected incorrectly, ic destruction may occur when used outside of the ope ration guarantee range. monolithic linear ic for car audio systems 4-channel btl power amplifier orderin g numbe r : ena2047
LV47022P no.a2047-2/12 specifications absolute maximum ratings at ta = 25 c parameter symbol conditions ratings unit maximum supply voltage v cc max1 no signal, t = 1 minute 26 v v cc max2 during operations 18 v maximum output current i o peak per channel 4.5/ch a allowable power dissipation pd max with an infinity heat sink 50 w operating temperature topr -40 to +85 c storage temperature tstg -40 to +150 c junction temperature tj 150 c thermal resistance between the junction and case j-c 1 c/w recommended operating ranges at ta = 25 c parameter symbol conditions ratings unit recommended load resistance r l op 4 operating supply voltage range v cc op a range not exceeding pdmax 8 to 16 v electrical characteristics at ta = 25c, v cc = 14.4v, r l = 4 , f = 1khz, rg = 600 parameter symbol conditions ratings unit min. typ. max. quiescent current i cco r l = , rg = 0 200 400 ma standby current ist vst = 0v 3 a voltage gain vg v o = 0dbm 25 26 27 db voltage gain difference vg -1 +1 db output power p o thd = 10% 23 28 w p o max1 max power 43 w p o max2 v cc = 15.2, max power 48 w output offset voltage vn offset rg = 0 -100 +100 mv total harmonic distortion thd p o = 4w 0.02 0.10 % channel separation chsep v o = 0dbm, rg = 10k 55 65 db ripple rejection ratio svrr rg = 0 , fr = 100hz, v cc r = 0dbm 50 65 db output noise voltage v no rg = 0 , b.p.f. = 20hz to 20khz 60 120 vrms input resistance ri 80 100 120 k mute attenuation matt v o = 20dbm, mute : on 80 90 db standby pin control voltage vstby h amp : on 2.5 v cc v vstby l amp : off 0.0 0.5 v mute pin control voltage vmute h mute : off 2.9 6.0 v vmute l mute : on 0.0 1.0 v output offset detection detection threshold voltage vosdet 1.2 1.8 2.4 v * 0dbm = 0.775vrms
LV47022P no.a2047-3/12 block diagram important points please connect pin1 line near c7 and c8 . because pin1 is substrate of ic. out 1 + v cc 3/4 v cc 1/2 ta b v cc out 1 - pwr gnd1 r l mute circuit stand by switch pwr gnd2 pwr gnd3 pwr gnd4 pre gnd 11 9 7 8 12 1 6 20 + 2 22 13 ac gnd 16 25 out 2 + out 2 - mute 5v offsetdiag 5 3 out 3 + out 3 - 15 17 19 18 in 4 14 stby 24 protective circuit 4 out 4 + out 4 - 21 23 high:amp on low:amp off ripple filter dc 10 + in 3 in 2 in 1 c1 c2 c6 c5 c3 c4 c8 c7 r2 r1 c9 high:mute off low:mute on r l r l protective circuit r l
LV47022P no.a2047-4/12 package dimensions unit : mm (typ) 3236a external components part name recommended value purpose remarks c1 to c4 0.22 f cuts dc voltage the larger the constant value, the lower the cut-off frequency. when amp on, bigger value worse pop noise. the values of c1 to c4 must be the same. c1 to c4 must use capacitor of low leak current. c5 1 f cuts dc voltage the ratio of the input capa citance (c1 to c4) to the acgnd capacitance (c5) should be 1:4. if the ratio deviates, pop noise and svrr are worse. use capacitor same as c1 to c4. c6 22 f reduces pop noise (amp on/off) reduces ripples the larger the constant value, th e longer the amplifier on/off time. the larger the constant value, svrr is good. on the other hand, the smaller constant value. amp on/off will be shoeter. c7 2200 f ripple filter eliminating power supply ripples. please put near ic. c8 0.1 f improves oscillation stability reducing high-frequency noise. please put near ic. c9 1 f reduces pop noise (mute on ? off) the larger the constant va lue, pop noise is small. the large the constant value, th e longer the mute on/off time. on the other hand, the smaller constant value. mute on/off will be shorter. and, mute on ? off pop noise will be worse. r1 47k r2 4.7k pull-up resistor because of transistor ability in ic, please use 2.2k or more. * the components and constant values within the test circuit are used for confirmation of characteristics and are not guarantee s that incorrect or trouble will not occur in application equipment. sanyo : hzip25 2.0 29.2 25.6 (22.8) (2.6) (5.0) (12.3) (1.0) 0.52 (r1.7) 0.4 18.6 max (14.4) 4.5 (11.0) 3.5 21.7 14.5 4.2 4.0 (8.5) ( 2.5) 125 2.0 pd max -- ta -40 -20 0 20 40 60 80 100 120 140 160 0 10 20 30 40 50 60 70 ambient temperature, ta -- c maximum power dissipation, pd max -- w infinite heat sink j-c=1 c/w no heat sink j-a=39 c/w heat sink( f=3.5 c/w) j-c+ f=4.5 c/w
LV47022P no.a2047-5/12 explanation for the function 1. standby switch function (pin 4) threshold voltage of the pin 4 is set by about 2vbe. the amplifier is turned on by the applied voltage of 2.5v or more. also, the amplifier is turned off by the applied voltage of 0.5v or less. fig1 standby equivalent circuit 2. muting function (pin 22) the muting function is turned on by the applied voltage of 1.0v or less to 22pin. and the muting function is turn off by the applied voltage 2.9v or more. also, the time constant of the muting function is determined by external capacitor and resistor constants. it is concerned with mute on/off. af ter enough examination, please set it. switching time mute on: c9 r1 mute off: (c9 v) / i (v= when mute on pin 22 voltage, i=about 5 a) fig2 mute equivalent circuit 3. input pin (pin 11/ pin 12/ pin 14/ pin 15), acgnd pin (pin 16) the ratio of the input capacitance (c1 to c4) to the acgnd capacitance (c5) should be 1:4. please use same kind of capacitor. please connect the acgnd capacitor to pregnd. it is all five pin 100k ? of input resistance. do not input below 0v to pin-in (pin 11/ pin12/ pin 14/ pin15). if you input below 0v to pin-in, LV47022P can not function well. + mute mute off on about 2.1v 22 r1 c9 stby 4
LV47022P no.a2047-6/12 4. self-diagnostics function (pin 25) in four modes to write below, the signal is output to the pin 25. also, by controlling the standby switch after the signal of th e pin 25 is detected by the microcomputer, the burnout of the speaker can be prevented. (1) shorting to v cc /shorting to ground : the pin 25 becomes the low level. (2) load shorting : the pin 25 is alternated between the low level and the high level according to the output signal. (3) over voltage : when the voltage of v cc exceeds voltage 21v (typical), the pin 25 becomes the low level. (4) output offset detection : wh en the output offset voltage exceed s the detection threshold voltage, the pin 25 becomes the low level. in addition, the pin 25 has become the npn open collector output (active low). the pin 25 must be left open when this function is not used. fig3 offset detection fig4 operating pin 25 + - + - 16 25 5v speaker pin output voltage +1.8v (typical) -1.8v (typical) time time 0v offset diag out + out - rt in ac gnd output voltage 25 pin voltage
LV47022P no.a2047-7/12 5. sound quality (low frequencies) by varying the value of input capacitor, low-frequency characteristic can be improved. however, it is concerned the pop noise. please conf irm in each set when the capacitance value varies. 6. pop noise for pop noise prevention, it is recommended to use the muting function at the same time. at amp on set mute on first, then set stby pin high ( amp on). about 1.5sec later, set to be mute off. at amp off after 10msec later mute on, pleas e do stby pin low ( amp off). 7. oscillation stability pay due attention on the following points because parasitic oscillation may occur due to effects of the board layout, etc. board layout ? provide the v cc capacitor of 0.1 f in the position nearest to ic. ? pregnd must be independently wired an d connected to the gnd poin t that is as stable as possible, such as the minus pin of the 2200 f v cc capacitor. in case of occurrence of parasitic oscillation, any one of following parts may be added as a countermeasure. please check your capacitor of optimal value at set ? series connection of cr (0.1 f and 2.2 ) between each output pin and gnd. 8. emc countermeasure LV47022P has function that decrease of electric mirror noise and gsm noise. when you connect capacitor of more th an 1000pf between out an d gnd because of emc countermeasure, please add oscillation cut parts. value of oscillation prevention parts recommends 2.2 + 0.1 f. stby (pin4) dc (pin10) mute (pin22) out more than 1.5sec stby (pin4) dc (pin10) mute (pin22) out more than 10msec
LV47022P no.a2047-8/12 0 50 100 150 200 250 0 2 4 6 8 10 12 14 616 8 10 12 14 8 10 12 14 16 18 0.01 10 10 0.1 23 57 23 57 23 57 110 23 57 23 57 23 57 23 57 100 1k 10k 100 10 100k 0 10 20 30 40 0.1 1 2 3 5 7 2 3 5 7 2 3 5 7 50 0 5 10 15 20 25 810121416 237 5237 5237 5237 5 100 1k 10k 18 thd -- p o 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 10 0.1 23 7 110 5237 5237 5 1 257 3257 3257 3 10 100 thd -- p o thd -- f 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 10 0.1 100 10 100k 618 i cco -- v cc thd -- p o v n -- v cc p o -- v cc p o -- f all channel is similar all channel is similar ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 10 supply voltage , v cc -- v quiescent current , i cco -- ma supply voltage , v cc -- v output power , p o -- w output power , p o -- w total harmonic distortion , thd -- % output power , p o -- w total harmonic distortion , thd -- % frequency , f -- hz total harmonic distortion , thd -- % frequency , f -- hz output power , p o -- w supply voltage , v cc -- v output midpoint voltage , v n -- v output power , p o -- w total harmonic distortion , thd -- %
LV47022P no.a2047-9/12 24 25 26 27 28 0 50 100 200 10 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100k 0 80 80 81012141618 10 100k 0 20 40 60 20 40 60 80 0 20 40 60 80 10 100k ch.sep -- f 0 20 40 60 0 20 40 60 80 10 100k ch.sep -- f svrr -- f r 0 20 40 60 80 10 100k 10 100k 10 100k respomse -- f svrr -- v cc v no -- rg ch.sep -- f ch.sep -- f ch1 ch2 ch1 ch4 ch1 ch3 ch2 ch1 ch2 ch4 ch2 ch3 ch3 ch1 ch3 ch4 ch3 ch2 ch4 ch1 ch4 ch3 ch4 ch2 150 all channel is similar 1 frequency , f -- hz response -- db frequency , f -- hz channel separation -- db frequency , f -- hz channel separation -- db frequency , f -- hz channel separation -- db ripple frequency , f r -- hz ripple rejection ratio , svrr -- db frequency , f -- hz channel separation -- db output noise voltage , v no -- v supply voltage , v cc -- v ripple rejection ratio , svrr -- db all channel is similar all channel is similar all channel is similar
LV47022P ps no.a2047-10/12 0 1 2 3 4 81012141618 0 50 100 150 200 250 0 20 40 60 80 100 0 1.0 2.0 3.0 4.0 1.0 2.0 3.0 4.0 5.0 0 5.0 offset diag -- v cc i cco -- vst mute att -- v mute all channel is similar 0 10 20 30 40 50 60 23 57 1 2 3 57 2 3 57 10 0.1 100 pd -- p o r g = 0 r l = 4 detection level v cc =14.4v output power , p o -- w power dissipation , pd -- w standby control voltage , vst -- v quiescent current , i cco -- ma mute control voltage , v mute -- v mute attenuation , mute att -- db power supply , v cc - v detection threshold voltage, v osdet - v all channel is similar
LV47022P ps no.a2047-11/12 hzip25 heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrench es should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. sanyo recommends yg-6260 (momentive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconducto r device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreas onable mechanical stress is not app lied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displ acement due to fluctuation of the spri ng force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
LV47022P ps no.a2047-12/12 sanyo semiconductor co.,ltd. assumes no responsib ility for equipment failures that result from using products at values that exceed, even momentarily, rate d values (such as maximum ra tings, operating condition ranges, or other parameters) listed in products specif ications of any and all sanyo semiconductor co.,ltd. products described or contained herein. sanyo semiconductor co.,ltd. strives to supply high-qual ity high-reliability products, however, any and all semiconductor products fail or malfunction with some probabi lity. it is possible that these probabilistic failures or malfunction could give rise to acci dents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause dam age to other property. when designing equipment, adopt safety measures so that these kinds of accidents or e vents cannot occur. such measures include but are not limited to protective circuits and error prevention c ircuits for safe design, redundant design, and structural design. upon using the technical information or products descri bed herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of sanyo semiconductor co.,ltd. or any third party. sanyo semiconductor co.,ltd. shall not be liable f or any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. information (including circuit diagr ams and circuit parameters) herein is for example only; it is not guaranteed for volume production. any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. when designing equi pment, refer to the "delivery specification" for the sanyo semiconductor co.,ltd. product that you intend to use. in the event that any or all sanyo semiconductor c o.,ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities conc erned in accordance with the above law. no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any in formation storage or retrieval system, or otherwise, without the prior written consent of sanyo semiconductor co.,ltd. this catalog provides information as of april, 2012. specifications and information herein are subject to change without notice.

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